CPU

Intel Core Ultra Series 3 (Panther Lake)

Backside power delivery separates power distribution from signal routing and can ease congestion in the front-side metal layers. Intel has published results from a PowerVia test vehicle; TSMC announced A16 with a backside power rail and production planned for 2026. Test figures and announced schedules do not guarantee equivalent results in commercial products.

Brand
Intel
Generation
Series 3
Status
Available
Announced
January 5, 2026
Released
January 27, 2026

Documented data

Specifications

Proceso de fabricación
Intel 18A con RibbonFET y PowerVia

Connections

Technologies and standards

  • technologyIntel 18A (RibbonFET + PowerVia)

Commercial context

Price and availability

Each price keeps its market, currency, seller and observation date; it does not imply current availability.

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Editorial context

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